The global printing and packaging sectors experienced a seismic shift this week as major industry players announced a series of strategic acquisitions and expansions. According to Ink World’s latest data for the week ending October 3, 2026, the consolidation of key digital printing technologies topped the list of most-read industry developments.
The week’s primary headline was the high-profile announcement that EFI and Agfa intend to combine their respective Digital Printing Solutions (DPS) businesses. This merger represents a significant consolidation within the industrial printing landscape, promising to reshape competition in the digital inkjet space by pooling resources and proprietary technologies. Industry analysts are closely watching the move, which suggests a growing trend toward integrated, high-scale solutions in professional print environments.
In the packaging segment, Smurfit Westrock captured headlines with its move to acquire the Chilean containerboard and corrugated business of Empresas CMPC S.A. (CMPC). This acquisition underscores Smurfit Westrock’s aggressive strategy to bolster its foothold in the South American market. By integrating CMPC’s established regional assets, the company is positioning itself to better serve the surging demand for sustainable packaging materials across Latin America.
International expansion also reached a new milestone as Crown Holdings officially broke ground on its first beverage can manufacturing facility in India. This move marks a pivotal entry for the company into one of the world’s most rapidly growing consumer markets. As India’s middle class expands and demand for packaged beverages rises, Crown Holdings’ local production capabilities are expected to provide a significant competitive advantage, reducing supply chain complexities and improving delivery lead times for regional partners.
Meanwhile, in the specialized sector of radiation curing, RadTech announced the launch of its new RTE Packaging Seminar, scheduled for November 4–5 in Milan, Italy. The event aims to bring together leading experts to discuss the latest advancements in UV/EB curing technologies specifically tailored for the packaging industry. The seminar is being positioned as a must-attend event for professionals looking to navigate the intersection of high-performance printing and strict regulatory standards for packaging materials.
Finally, the electronics and infrastructure space saw a branding milestone as Flex revealed the identity of its upcoming spin-off company. The new entity, focused on cloud and power infrastructure, will operate under the name “Axiom.” The rebranding marks a formal step toward separating these high-growth technology assets from the main Flex organization, a move investors believe will provide the new business with the autonomy needed to scale within the competitive data center and power infrastructure markets.
As these developments unfold, the industry remains in a state of rapid transition, with major players betting heavily on regional growth and technological synergy. From the consolidation of digital printing powerhouses to the unveiling of new infrastructure giants, the industry continues to evolve to meet the demands of a globalized economy.
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